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us patent application for semiconductor structure and

Apr 07, 2020 · A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate, a resistive random access memory cell, and a semiconductor element. The resistive random access memory cell is on the substrate. The resistive random access memory cell includes a first electrode having a U shape. The semiconductor element …

searchpatentclassification systems

Machine element or mechanism 075 Specialized metallurgical processes, compositions for use therein, consolidated metal powder compositions, and loose metal particulate mixtures

us20040032013a1 -semiconductordice ... - googlepatents

A method and apparatus for assembling and packaging semiconductor dice. The semiconductor dice or assemblies of stacked and electrically interconnected semiconductor dice are placed at mutually spaced locations with respect to a common plane and encapsulated in a dielectric material so that end portions of discrete conductive elements extending outward from each semiconductor die adjacent the

us patent for semiconductor structure and method for

Apr 10, 2018 · A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate, a resistive random access memory cell, and a semiconductor element. The resistive random access memory cell is on the substrate. The resistive random access memory cell includes a first electrode having a U shape. The semiconductor element …

semiconductor elementand a method ofmanufacturingthe

A method of manufacturing a semiconductor element according to a still further aspect of the present invention includes the steps of forming a silicon oxide film on one surface of a silicon substrate, ion implanting chromium or a chromium oxide into the surface of the silicon substrate, applying a heat treatment to the silicon substrate with the ion-implanted silicon oxide film to cause inclusion of the …

us patentforsemiconductor device including antistatic

Aug 22, 2017 · This Utility Patent Application is a continuation application of U.S. application Ser. No. 15/057,481, filed Mar. 1, 2016, which is incorporated herein by reference. BACKGROUND. Current sensors, current transducers, magnetic couplers, and other electromagnetic field devices may be integrated into a semiconductor device package

patent licensing companies in the semiconductor market

Mar 13, 2017 · More than 2,880 semiconductor-related US patents have been acquired by PLCs since 2013. Now, it is a critical time to assess the patent litigation risks and …

ekambaram sambandan- principal scientist - nitto denko

Multivalence photocatalytic semiconductor elements (US Patent #9376332): 1. Phosphor composition and light emitting device using the same (US Patent # 8207663): Invented a novel phosphor

analytics forus patentapplication no. 10158036

There is to provide a semiconductor device including a light receiving element capable of reducing the manufacturing cost and improving the . Trigger. Patent Buddy ... Semiconductor device and its manufacturing method Number of patents in Portfolio can not be more than 2000 United States of America Patent. PATENT NO: 10158036: APP PUB NO

patents- luxon optical -google sites

M.M. Tilleman, and J.R. Lyford, “System and method for projecting synthetic imagery using and scenic imagery using an optical component comprising diffractive optical element pattern”, U.S. Patent Application 61/556,618, Serial No. 981137 filed in November 7, 2012

jianfeng luo - google scholar

US Patent 7,509,622, ... using the boundary element method. JF Luo, YJ Liu, EJ Berger. Computational Mechanics 22 (5), 404-412, 1998. 175: 1998: Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification. J Luo, DA Dornfeld. IEEE Transactions on Semiconductor Manufacturing 16 (3), 469-476, 2003. 163

visible scintillation photodetector device incorporating

A method for synthesizing I-III-VI.sub.2 compounds, including: melting a Group III element; adding a Group I element to the melted Group III element at a rate that allows the Group I and Group III elements to react thereby providing a single phase I-III compound; and adding a Group VI element to the single phase I-III compound under heat, with mixing, and/or via vapor transport

class schedule for class 257 active solid-state devices (e

481 : Avalanche diode (e.g., so-called "Zener" diode having breakdown voltage greater than 6 volts) ... With semiconductor element forming part (e.g., base, of housing) 685 : Multiple housings ... " at the end of a title indicates both European and US patent documents, as classified by the EPO, are regularly added to the subclass. E-subclasses

method ofmanufacturing semiconductordevice by forming

A method of manufacturing a semiconductor device, comprising: forming a base film containing a first element, carbon, and oxygen on a substrate by performing a cycle a predetermined number of times, the cycle including performing: forming a layer containing the first element, carbon and chlorine on the substrate by supplying a film forming gas containing chlorine to the substrate; and oxidizing the layer containing the first element…

interconnections for fine pitchsemiconductordevices and

A semiconductor device and a manufacturing method thereof are provided. The semiconductor device has an active surface. ... US Patent References: 7271483: ... That is, the second dimension D122 of the first metal layer 151 is equivalent to the second dimension D122 of FIG. 5

us patent class 438--semiconductordevicemanufacturing

US Patent Class 438 SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS-- Main Headings. Electronic File Wrappers: Electronic ... TERNARY OR QUATERNARY SEMICONDUCTOR COMPRISED OF ELEMENTS FROM THREE DIFFERENT GROUPS (E.G., I-III-V, ETC.) 931 DF : ... FOR 481 DF : DIFFERENTIAL CRYSTAL GROWTH (437/970) FOR 482

professor osamu goto meng research group

SEMICONDUCTOR LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD: 03: US8270450: Method of manufacturing semiconductor laser, semiconductor laser,

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